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CoolPoly® Thermally Conductive Plastics

For Light Emitting Diodes (LED)

CoolPoly Benefits

CoolPoly® thermally conductive injection molding grade thermoplastics are ideal for managing the heat output of light emitting diodes (LEDs). Thermally conductive plastics can be used at the die, board and enclosure levels to reduce temperatures, enhance brightness and increase lifetime.

At the die level, thermally conductive plastics provide low CTE and thermally conductive mass to help transfer and dissipate heat close to the source. CoolPoly D5506 thermally conductive LCP is a good choice for die level encapsulation.

At the board level, thermally conductive plastics provide three-dimensional molded substrates that transfer LED energy similar to ceramic boards and metal backed boards. CoolPoly D5108 is a good choice for board level construction.

At the enclosure level, thermally conductive plastics can be molded to a net shape the serves as a heat sink and a mechanical enclosure. CoolPoly E5101 and E3603 are appropriate choices for LED enclosures.

Additionally, compliant thermally conductive materials, like D8102, can be molded in enclosures to provide three-dimensional thermal interfaces and sealing gaskets.

Millions of LED thermal management components have been molded from CoolPoly thermally conductive plastics.

LED thermal management solutions molded from thermally conductive plastics can provide:

  • LOW THERMAL RESISTANCE

  • LOW COST

  • 3-DIMENSIONAL COMPLEXITY

  • LOW WEIGHT

  • ADDED CONVECTIVE SURFACES

  • MOLDED IN THERMAL INTERFACE

  • COMPONENT INTEGRATION

 

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Related Information

CoolPoly Thermally Conductive Plastics For Reflectors CoolPoly thermally conductive injection molding grade thermoplastics significantly reduce surface and part temperatures in lighting reflectors. >>More

CoolPoly® Solid Shapes

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FAQs

Answers to the most commonly asked questions regarding thermally conductive polymers.

See Also

CoolPoly E-series

CoolPoly D-series

CoolPoly Elastomers

Processing Guidelines

CoolPoly Solid Shapes

CoolPoly Selection Tool

Application Reviews

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D-Series Datasheets

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Recommended Material(s):
D5506(LCP) Board/die level, dielectric V0
E5101(PPS) Heat sink V0
D8102(TPE) Interface  
D5108(PPS) Board/die level, dielectric V0
E4501(PC) Enclosure and Reflector  
E4505(PC) Enclosure and Reflector V0

 

 

 

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