Many
electronic enclosures require both heat transfer and
shielding from electromagnetic or radio frequency
interference (EMI/RFI). Metal enclosures can provide
these properties but are often too heavy or
undesirable. Plastic
enclosures are sometimes painted, plated or modified
to provide shielding properties but are thermally
insulative and restrict heat flow. An ideal solution
would be a single material that could provide low
weight, thermal conductivity, and EMI/RFI shielding.
CoolPoly
thermally conductive and shielding plastics provide
both the required heat transfer and shielding
characteristics in an injection moldable plastic. In
many applications, the CoolPoly plastic transfers
heat similar to aluminum and provides EMI/RFI
attenuation of greater than 60dB over a broad
frequency range.
Electronic enclosures molded from CoolPoly shielding plastics
offer:
CoolPoly
thermally conductive plastic enclosures have been
commercially proven to reduce cost by as much as 50%
compared to die cast aluminum housings while
providing equivalent heat transfer. >>More
enclosures are sometimes painted, plated or modified
to provide shielding properties but are thermally
insulative and restrict heat flow. An ideal solution
would be a single material that could provide low
weight, thermal conductivity, and EMI/RFI shielding.
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