CoolPoly
thermally conductive injection molding grade
thermoplastics are ideal low cost substitutes for
ceramic substrates and other electronic packaging
components. Historically, ceramics have been common
electronic substrate materials due to a combination
of dielectric properties and thermal conductivity.
CoolPoly
thermally conductive plastic has been shown in
commercial applications to represent up to a 50%
cost reduction versus an alumina substrate while
providing equivalent heat transfer.
Net
shape, 3-dimensional injection molding of thermally
conductive plastics meets electronic packaging
suppliers’ goals of miniaturization, integration and
speed while significantly reducing the time,
temperature, complexity and cost of the
manufacturing process.
Thermally conductive plastics offer:
Low cost, excellent
heat transfer
Design and
manufacturing flexibility
Similar dielectric,
physical and thermal properties to alumina
thermally conductive plastic has been shown in
commercial applications to represent up to a 50%
cost reduction versus an alumina substrate while
providing equivalent heat transfer.
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